Forced air convection reflow oven MR260

Home

Products

Reflow Ovens

The MR260 convection reflow soldering systems uses re-circulated hot air to accomplish reflow at much lower temperatures than IR systems. Using constant, even heating, a great variety of board sizes will reach reflow temperature with the same heat profile. All heating parameters and registered profiles can be easily observed on built-in 17" LCD display.

By eliminating set-up time your production line can work to its fullest capacity.

Product image

Features

Forced air convection heat to maximum temperatures up to 280°C.
Forced air convection provides uniform heating and prevents shadowing.
Three heating zones, one cooling zone; each independently controlled for accurate temperature profiles.
Digital PID regulators ensuring high stability of each zone temperature.
Output to external storage device for print-out program data and temperature profiles.
4-channel PCB temperature registration

Technical specs

Power requirements: 208/240VAC 1-phase
Rated power max.: 3800 Watts
17" LCD
Dynamic warming-up control ensuring stable temperaturesand virtually no overshoot.
USB port for external storage.
Profiling software for temperature data recording.
Graphic display mode for viewing temperature on a time base.
3 heating zones, one cooling zone.
Stainless steel mesh conveyor belt
Conveyor speed: 5 - 800 mm/min (0.2 - 31.5 inch/min)
Up to 280° C for lead free soldering.
Clearance for assemblies up to 25mm (1 inch)
Soldering width: 260 mm (10 inch)
Length process chamber: 900 mm (35 inch)
Heat-up time: approx. 15 min.
Dimensions: 1650 x 500 x 360 mm (L x W x H)
Net weight: 80 kg

[ Back ]